Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17491825
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Filing Dt:
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10/01/2021
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Publication #:
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Pub Dt:
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04/06/2023
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Inventors:
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KEISUKE OTSUKA, TSUYOSHI TOMOYAMA
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Title:
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METHODS FOR FORMING OPENINGS IN CONDUCTIVE LAYERS AND USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83716 |
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DORSEY & WHITNEY LLP |
701 5TH AVE #6100 |
SEATTLE, WA 98104 |
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09/22/2024 06:08 PM
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