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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11799008	Issue Dt:	10/24/2023	Application #:	17174920	Filing Dt:	02/12/2021
Publication #:	20220238670	Pub Dt:	07/28/2022
Inventors:	Ming Jian WANG, Cun Cun CHEN, Xin Yong WANG, Jia Liang ZHONG
Title:	SEMICONDUCTOR DEVICE AND METHOD OF USING

Assignment: 1

Reel/Frame:

055246/0618

Recorded: 02/12/2021

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

WANG, MING JIAN

Exec Dt:

11/11/2020

WANG, XIN YONG

Exec Dt:

11/05/2020

CHEN, CUN CUN

Exec Dt:

11/10/2020

ZHONG, JIA LIANG

Exec Dt:

11/05/2020

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

HAUPTMAN HAM, LLP (TSMC)

2318 MILL ROAD

SUITE 1400

ALEXANDRIA, VA 22314

Assignment: 2

Reel/Frame:

055318/0681

Recorded: 02/17/2021

Pages: 8

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES PREVIOUSLY RECORDED ON REEL 055246 FRAME 0618. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEES SHOULD BE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. AND TSMC CHINA COMPANY, LIMITED.

Assignors:

WANG, MING JIAN

Exec Dt:

11/11/2020