Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
10/31/2023
|
Application #:
|
17108079
|
Filing Dt:
|
12/01/2020
|
Publication #:
|
|
Pub Dt:
|
06/10/2021
| | | | |
Inventors:
|
Ralf Otremba, Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean et al
|
Title:
|
Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
|
|
|
MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
1255 CRESCENT GREEN |
SUITE 200 |
CARY, NC 27518 |
|
|
Search Results as of:
09/22/2024 05:56 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|