Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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16586309
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Filing Dt:
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09/27/2019
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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John J. Wuu, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal
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Title:
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SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2485 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| MEYERTONS HOOD KIVLIN KOWERT & GOETZEL |
| P.O. BOX 398 |
| AUSTIN, TX 78767-0398 |
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