Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17102249
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Filing Dt:
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11/23/2020
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Publication #:
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Pub Dt:
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05/27/2021
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Inventors:
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Eric Beyne, Jaber Derakhshandeh, Gerald Peter Beyer
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Title:
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METHOD OF DIRECT BONDING SEMICONDUCTOR COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| KNOBBE, MARTENS, OLSON & BEAR, LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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08/05/2025 07:04 PM
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