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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/14/2023
Application #:
17676694
Filing Dt:
02/21/2022
Publication #:
Pub Dt:
08/04/2022
Inventor:
Shih-Lien Linus Lu
Title:
Integrated Circuit Layout, Integrated Circuit, and Method for Fabricating the Same
Assignment: 1
Reel/Frame:
059149/0190Recorded: 03/02/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/04/2020
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
MERCHANT & GOULD PC
P.O. BOX 2903
MINNEAPOLIS, MN 55402-0903

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