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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11830787	Issue Dt:	11/28/2023	Application #:	16532956	Filing Dt:	08/06/2019
Publication #:	20210043541	Pub Dt:	02/11/2021
Inventors:	Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan
Title:	THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

Assignment: 1

Reel/Frame:

049981/0946

Recorded: 08/06/2019

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

EID, FERAS

Exec Dt:

08/01/2019

KAMGAING, TELESPHOR

Exec Dt:

08/02/2019

DOGIAMIS, GEORGIOS

Exec Dt:

08/02/2019

ALEKSOV, ALEKSANDAR

Exec Dt:

08/02/2019

SWAN, JOHANNA M.

Exec Dt:

08/02/2019

Assignee:

MCAFEE, LLC

2200 MISSION COLLEGE BOULEVARD

SANTA CLARA, CALIFORNIA 95054

Correspondent:

LAURA A. ZAGER

2816 LAGO VISTA LANE

PATENT CAPITAL GROUP

ROCKWALL, TX 75032

Assignment: 2

Reel/Frame:

049997/0308

Recorded: 08/08/2019

Pages: 5

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY FROM MCAFEE, LLC TO INTEL CORPORATION PREVIOUSLY RECORDED ON REEL 049981 FRAME 0946. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

EID, FERAS

Exec Dt:

08/01/2019