Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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17028072
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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04/08/2021
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Inventors:
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Katsuhide Watanabe, Yoichi Shiokawa, Keita Yagi, Akira Nakamura
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Title:
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SUBSTRATE POLISHING APPARATUS, METHOD OF CREATING THICKNESS MAP, AND METHOD OF POLISHING A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 144-8510 |
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| BAKERHOSTETLER |
| 999 THIRD AVENUE |
| SUITE 3600 |
| SEATTLE, WA 98104-4040 |
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