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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/05/2023
Application #:
18215744
Filing Dt:
06/28/2023
Inventors:
Harald KOBOLLA, Rainer POPP, Marco LEDERER
Title:
MODULE HAVING A MOULDED PLASTIC BODY AND A MULTIPLICITY OF LOAD TERMINAL ELEMENTS AND POWER SEMICONDUCTOR DEVICE THEREWITH
Assignment: 1
Reel/Frame:
064240/0985Recorded: 07/13/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2023
Exec Dt:
07/12/2023
Exec Dt:
07/12/2023
Assignee:
SIGMUNDSTR. 200
NUREMBERG, GERMANY 90431
Correspondent:
ANDREW F. YOUNG, ESQ.
NOLTE LACKENBACH SIEGEL
111 BROOK STREET, STE. 101
SCARSDALE, NY 10583

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