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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11842922
Issue Dt:
12/12/2023
Application #:
17399262
Filing Dt:
08/11/2021
Publication #:
20230050514
Pub Dt:
02/16/2023
Inventors:
Chun-Kai Chen, Jei Ming Chen, Tze-Liang Lee
Title:
METHOD FOR FORMING INTERCONNECT STRUCTURE
Assignment: 1
Reel/Frame:
057145/0265Recorded: 08/11/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, CHUN-KAI
Exec Dt:
08/05/2021
CHEN, JEI
Exec Dt:
08/08/2021
LEE, TZE-LIANG
Exec Dt:
08/05/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
058282/0524Recorded: 11/30/2021Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTED ASSIGNMENT TO CORRECT 2ND INVENTOR NAME PREVIOUSLY RECORDED PREVIOUSLY RECORDED AT REEL: 057145 FRAME: 0265. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
CHEN, CHUN-KAI
Exec Dt:
08/05/2021
CHEN, JEI MING
Exec Dt:
08/15/2021
LEE, TZE-LIANG
Exec Dt:
08/05/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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