Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2023
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Application #:
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17366575
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Filing Dt:
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07/02/2021
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Publication #:
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Pub Dt:
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11/11/2021
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Inventors:
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Jie CHEN, Ying-Ju CHEN, Hsien-Wei CHEN, Der-Chyang YEH, Chen-Hua YU
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Title:
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REDISTRIBUTION LAYER STRUCTURES FOR INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1101 K STREET, N.W., 10TH FLOOR |
| WASHINGTON, DC 20005 |
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