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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/26/2023
Application #:
17346972
Filing Dt:
06/14/2021
Publication #:
Pub Dt:
10/27/2022
Inventors:
Ming-Chih Yew, Chien-Sheng Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng
Title:
Semiconductor Devices and Methods of Manufacturing
Assignment: 1
Reel/Frame:
056535/0410Recorded: 06/14/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/07/2021
Exec Dt:
06/07/2021
Exec Dt:
06/07/2021
Exec Dt:
06/07/2021
Exec Dt:
06/07/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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