Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17461001
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Yu-Fang Huang, Ying-Liang Chuang, Ming-Hsi Yeh, Chun-Cheng Chou, Kuo-Ju Chen et al
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Title:
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ETCH METHOD FOR INTERCONNECT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN ROAD 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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