Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17156833
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
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07/15/2021
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Inventors:
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Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim et al
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Title:
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WAFER LEVEL FAN OUT SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
SUITE 3400 |
CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
VALLEY POINT #12/03 |
SINGAPORE, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
SUITE 3400 |
CHICAGO, IL 60661 |
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09/19/2024 10:12 PM
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