Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17867771
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Filing Dt:
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07/19/2022
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Publication #:
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Pub Dt:
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11/03/2022
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Inventors:
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Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu et al
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Title:
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BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & POTASHNIK |
| 629 EUCLID AVENUE |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
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