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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/02/2024
Application #:
17319368
Filing Dt:
05/13/2021
Inventors:
Heesoo KANG, Seong Yeol MUN, Xiang ZHANG
Title:
SHALLOW TRENCH ISOLATION (STI) STRUCTURE FOR CMOS IMAGE SENSOR
Assignment: 1
Reel/Frame:
056230/0359Recorded: 05/13/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Exec Dt:
05/12/2021
Assignee:
4275 BURTON DRIVE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
CURTIS A. VOCK LATHROP GPM LLP
2440 JUNCTION PLACE
SUITE 300
BOULDER, CO 80301

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