Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17725072
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Filing Dt:
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04/20/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Paul Abel, Arkalgud Sitaram, Christopher Netzband, Jacques Faguet
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Title:
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Methods For Wet Atomic Layer Etching Of Copper
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| TEL-EGAN, ENDERS & HUSTON LLP. |
| 1101 S. CAPITAL OF TEXAS HIGHWAY |
| BLDG. C, SUITE 200 |
| AUSTIN, TX 78746 |
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