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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/09/2024
Application #:
17127928
Filing Dt:
12/18/2020
Publication #:
Pub Dt:
05/26/2022
Inventors:
Fu-Li Wang, Li Yu
Title:
Defective Soldering Point Intensive Extent Analysis System For Solder Paste Inspection And Method Thereof
Assignment: 1
Reel/Frame:
054700/0247Recorded: 12/18/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/18/2020
Exec Dt:
12/17/2020
Assignees:
789 PUXING ROAD, MIN HANG DISTRICT
SHANGHAI, CHINA 201114
NO.66, HOU-KANG ST., SHIH-LIN DISTRICT
TAIPEI CITY, TAIWAN TAIPEI CITY
Correspondent:
STEVENS LAW GROUP
1754 TECHNOLOGY DRIVE
SUITE #226
SAN JOSE, CA 95110

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