Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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18154576
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Filing Dt:
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01/13/2023
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Randy Renfu Huang, Richard John Heaton, Ron Diamant
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Title:
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DYNAMIC PROCESSING ELEMENT ARRAY EXPANSION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO BOX 81226 |
| SEATTLE, WASHINGTON 98108-1226 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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06/19/2024 04:39 PM
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