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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/09/2024
Application #:
17874488
Filing Dt:
07/27/2022
Publication #:
Pub Dt:
02/01/2024
Inventors:
Hiroshi Ukegawa, Feng Zhou
Title:
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATING LAYER
Assignment: 1
Reel/Frame:
060638/0960Recorded: 07/27/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/20/2022
Exec Dt:
07/20/2022
Assignee:
6565 HEADQUARTERS DRIVE W1-3C
PLANO, TEXAS 75024
Correspondent:
DINSMORE & SHOHL LLP
255 E. FIFTH STREET
SUITE 1900
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
066467/0436Recorded: 02/15/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/02/2024
Assignees:
1, TOYOTA-CHO
TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571
500-1 MINAMIYAMA
KOMENOKICHO, NISSHIN CITY, JAPAN 470-0111
1-1, SHOWA-CHO
KARIYA, AICHI, JAPAN 448-8664
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET
SUITE 1900
CINCINNATI, OH 45202

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