Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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18312599
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Filing Dt:
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05/05/2023
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Inventors:
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Sheng-Fan YANG, Hao-Yu TUNG, Hung-Yi CHANG, Wei-Chiao WANG, Yi-Tzeng LIN
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Title:
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INTERPOSER ROUTING STRUCTURE AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, LI-HSIN 6TH ROAD, HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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05/30/2024 12:52 PM
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