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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	11869872	Issue Dt:	01/09/2024	Application #:	17634081	Filing Dt:	02/09/2022
Publication #:	20230178514	Pub Dt:	06/08/2023
Inventors:	Yao Wang, Yunzhi Ling, Yinhua Cui, Chuan Hu, Zibai Li, Wei Zhao, Zhitao Chen
Title:	CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD

Assignment: 1

Reel/Frame:

058939/0636

Recorded: 02/09/2022

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

WANG, YAO

Exec Dt:

01/10/2022

LANG, YUNZHI

Exec Dt:

01/10/2022

CUI, YINHUA

Exec Dt:

01/10/2022

HU, CHUAN

Exec Dt:

01/10/2022

LI, ZIBAI

Exec Dt:

01/10/2022

ZHAO, WEI

Exec Dt:

01/10/2022

CHEN, ZHITAO

Exec Dt:

01/10/2022

Assignee:

INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES

363 CHANGXING ROAD

TIANHE DISTRICT

GUANGZHOU, GUANGDONG, CHINA 510650

Correspondent:

GARDNER, LINN, BURKHART & ONDERSMA LLP

2900 CHARLEVOIX DRIVE SE

SUITE 300

GRAND RAPIDS, MI 49546

Assignment: 2

Reel/Frame:

059352/0749

Recorded: 02/22/2022

Pages: 4

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 058939 FRAME: 0636. ASSIGNOR(S) HEREBY CONFIRMS THE ASSINMENT.

Assignors:

WANG, YAO

Exec Dt:

01/10/2022