Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17283511
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Filing Dt:
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04/07/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Inventors:
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Rongzhe Guo, Tao Zeng, Qian Feng
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Title:
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HIGH-DENSITY EDGE CONNECTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE D3, MOLDING TOOL INDUSTRIAL PARK |
| WEST DISTRICT OF CHENGDU TECH ZONE |
| CHENGDU, SICHUAN, CHINA 611731 |
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| EDMUND J. WALSH |
| WOLF, GREENFIELD & SACKS, P.C. |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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05/31/2024 03:41 PM
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