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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/23/2024
Application #:
18035890
Filing Dt:
05/08/2023
Publication #:
Pub Dt:
12/21/2023
Inventors:
Toshiharu Marui, Tetsuya Hayashi, Keiichiro Numakura, Wei Ni, Ryota Tanaka et al
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Assignment: 1
Reel/Frame:
063579/0966Recorded: 05/09/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Assignees:
2, TAKARA-CHO, KANAGAWA-KU, YOKOHAMA-SHI
KANAGAWA, JAPAN 221-0023
122-122 BIS, AVENUE DU GENERAL LECLERC
BOULOGNE-BILLANCOURT, FRANCE 92100
Correspondent:
THOMAS K. SCHERER
1100 LOUISIANA
SUITE 4900
HOUSTON, TX 77002

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