Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17357666
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Filing Dt:
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06/24/2021
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Publication #:
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Pub Dt:
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12/29/2022
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Inventors:
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Jung-Hun Seo, Yixiong Zheng, Matthias Muehle
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Title:
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DEEP ETCHING SUBSTRATES USING A BI-LAYER ETCH MASK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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44792 HELM STREET |
PLYMOUTH, MICHIGAN 48170 |
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FOLEY & LARDNER LLP |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007-5109 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TECHNOLOGY TRANSFER, UNIVERSITY AT BUFFALO |
520 LEE ENTRANCE, SUITE 109, UB COMMONS |
AMHERST, NEW YORK 14228 |
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FOLEY & LARDNER LLP |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007-5109 |
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09/22/2024 10:40 PM
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