Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17052853
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Filing Dt:
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03/23/2021
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Publication #:
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Pub Dt:
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03/30/2023
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Inventors:
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Bao ZHU, Lin CHEN, Qingqing SUN, Wei ZHANG
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Title:
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THROUGH SILICON VIA STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGING AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 220 HANDAN ROAD |
| YANGPU DISTRICT |
| SHANGHAI, CHINA 200433 |
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| ROOM 401-23, NO. 690 |
| BIBO ROAD, PILOT FREE TRADE ZONE |
| SHANGHAI, CHINA 200120 |
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| THOMAS E. LEES, LLC |
| 90 RHOADS CENTER DRIVE |
| DAYTON, OH 45458 |
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06/19/2024 06:43 PM
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