Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17098662
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Filing Dt:
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11/16/2020
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Publication #:
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Pub Dt:
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05/27/2021
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Inventors:
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Ke Dai, Jian Wei, Jiajia Yan
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Title:
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PACKAGE STRUCTURE FOR POWER SUPPLY MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 301, ZONE B, BUILDING F |
XUZHUANG SOFTWARE PARK, XUANWU DISTRICT |
NANJING, CHINA 210042 |
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MICHAEL C. STEPHENS |
22779 MONTROSE COURT |
LOS GATOS, CA 95033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1#368, BRAINSTORMING SPACE, SOFTWARE PARK |
NO. 10 TIANTONG ROAD, HIGH-TECH ZONE |
HEFEI CITY, ANHUI PROVINCE, CHINA 230088 |
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MICHAEL C. STEPHENS |
22779 MONTROSE COURT |
LOS GATOS, CA 95033 |
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09/23/2024 02:57 AM
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