Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17455709
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Filing Dt:
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11/19/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Inventors:
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Teppei YAMAGUCHI, Yoshio TSUKIYAMA
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Title:
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PACKAGE WITH AN ELECTRODE-ATTACHED FRAME SUPPORTED BY A HEAT SINK, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE PROVIDED THEREWITH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2701-1, AZA IWAKURA, OMINECHO-HIGASHIBUN |
| MINE-SHI, YAMAGUCHI-PREFECTURE, JAPAN 759-2212 |
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI-PREFECTURE, JAPAN 467-8530 |
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| STEPHEN P. BURR |
| BURR & BROWN, PLLC |
| P.O. BOX 869 |
| FAYETTEVILLE, NY 13066 |
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