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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/13/2024
Application #:
17956123
Filing Dt:
09/29/2022
Publication #:
Pub Dt:
05/18/2023
Inventors:
Sunggue Lee, Hyeonwoo Ahn
Title:
Semiconductor packaging including photovoltaic particles having a core-shell structure
Assignment: 1
Reel/Frame:
061552/0245Recorded: 10/26/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/29/2022
Exec Dt:
09/29/2022
Assignee:
#606, 545, DUNCHON-DAERO, JUNGWON-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13215
Correspondent:
AMANDA M. PROSE
121 SOUTH EIGHTH STREET, SUITE 1100
WESTMAN, CHAMPLIN & KOEHLER, P.A.
MINNEAPOLIS, MN 55402

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