Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17550479
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Filing Dt:
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12/14/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Arthur H. Depoi, John Robert Masotta, Boris Rozenfeld, Daniel Wright, Anthony E. Yap
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Title:
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INTEGRATED ENVELOPE SEALER AND FLIP MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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37 EXECUTIVE DRIVE |
DANBURY, CONNECTICUT 06810 |
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BROWN RUDNICK LLP |
ONE FINANCIAL CENTER |
BOSTON, MA 02111 |
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Assignment:
2
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ONE BRYANT PARK |
NEW YORK, NEW YORK 10036 |
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CT CORPORATION |
4400 EASTON COMMONS WAY |
SUITE 125 |
COLUMBUS, OH 43219 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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321 N CLARK ST STE 350 |
CHICAGO, ILLINOIS 60654 |
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NOREEN GOSSELIN |
KIRKLAND & ELLIS LLP |
300 NORTH LASALLE |
CHICAGO, IL 60654 |
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09/21/2024 10:09 PM
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