Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17371556
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Filing Dt:
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07/09/2021
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Inventors:
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Ya Hui Chang, Yu-Tse Lai
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Title:
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Via-First Self-Aligned Interconnect Formation Process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 056802 FRAME: 0908. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST.
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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Search Results as of:
05/30/2024 01:51 AM
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