Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17747981
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Filing Dt:
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05/18/2022
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Chia Chun HSU, Chin-Feng WANG
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Title:
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METHOD FOR MANUFACTURING A PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANZIH DIST. |
| KAOHSIUNG, TAIWAN 811 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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