Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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18262192
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Filing Dt:
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07/19/2023
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Li LIN, Zhiyuan MA, Yijia CHEN, Luoming SUN, Xiyu XIE
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Title:
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HIGH-THROUGHPUT MICROSTRUCTURE CHARACTERIZATION AND RECONSTRUCTION METHOD OF HETEROGENEOUS MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.2 LINGGONG ROAD, HI-TECH DISTRICT |
DALIAN, LIAONING, CHINA 116024 |
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NKL LAW |
3251 BLENHEIM BLVD. SUITE 500 |
FAIRFAX, VA 22030 |
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09/26/2024 08:37 AM
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