Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
02/27/2024
|
Application #:
|
17865851
|
Filing Dt:
|
07/15/2022
|
Publication #:
|
|
Pub Dt:
|
02/16/2023
| | | | |
Inventors:
|
Sung Yup KIM, Jae Hwan SON, Seung Dae BAEK, Jin Won KIM
|
Title:
|
WAFER PROCESSING METHOD
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
132, ANNYEONGNAM-RO |
HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 18363 |
|
|
|
KILE PARK REED & HOUTTEMAN PLLC |
1101 30TH ST., NW |
SUITE 500 |
WASHINGTON, DC 20007 |
|
|
Search Results as of:
06/22/2024 04:14 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|