Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17057981
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Filing Dt:
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11/23/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Zhaowei JIA, Jian WANG, Hui WANG, Hongchao YANG
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Title:
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ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BUILDING 4, NO.1690, CAI LUN ROAD |
ZHANGJIANG HIGH-TECH PARK |
SHANGHAI, CHINA 201203 |
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JEFFREY S. BERGMAN |
909 FANNIN ST. |
STE 3500 |
HOUSTON, TX 77010 |
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06/18/2024 01:53 AM
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