Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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17441587
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Filing Dt:
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09/21/2021
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Publication #:
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Pub Dt:
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06/16/2022
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Inventors:
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Kohsuke TSUCHIYA, Maki ASADA, Satoshi MOMOTA
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Title:
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METHOD OF POLISHING OBJECT TO BE POLISHED CONTAINING MATERIAL HAVING SILICON-SILICON BOND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO |
| KIYOSU-SHI, AICHI, JAPAN 452-8502 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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