Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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17404053
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Filing Dt:
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08/17/2021
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Publication #:
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Pub Dt:
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03/31/2022
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Inventors:
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Jong Min Jang, Byoung Ju Choi, Kwang Joo Lee, Yu Lin Sun
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Title:
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RESIN COMPOSITION FOR BONDING SEMICONDUCTOR AND ADHESIVE FILM FOR SEMICONDUCTOR USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 607 14TH STREET, N.W. SUITE 800 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE TYPO IN INVENTOR BYUNG JU CHOI'S NAME IS BYOUNG JU CHOI PREVIOUSLY RECORDED AT REEL: 057381 FRAME: 0145. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 607 14TH STREET, N.W. SUITE 800 |
| WASHINGTON, DC 20005 |
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