Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2024
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Application #:
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17680306
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Jing ZHANG, Genglin DING
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Title:
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Heat Dissipation Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BUILDING D, YINGTELI HIGH-TECH INDUSTRIAL PARK, NO.1 GAOPING AVENUE WEST, SANJIAO TOWN |
ZHONGSHAN, CHINA |
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ANNIE OUYANG |
BANTIAN SUBDISTRICT LONGGANG DISTRICT |
SHENZHEN, CHINA |
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06/01/2024 10:55 AM
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