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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/26/2024
Application #:
17478539
Filing Dt:
09/17/2021
Publication #:
Pub Dt:
04/06/2023
Inventors:
John Jianhong Zhu, Giridhar Nallapati, Junjing Bao
Title:
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
Assignment: 1
Reel/Frame:
057958/0552Recorded: 10/29/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/18/2021
Exec Dt:
10/03/2021
Exec Dt:
10/24/2021
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
W&T/QUALCOMM
106 PINEDALE SPRINGS WAY
CARY, NC 27511

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