Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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17813648
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Filing Dt:
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07/20/2022
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Inventors:
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Feng-Cheng HSU, Shuo-Mao CHEN, Shin-Puu JENG
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Title:
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CHIP PACKAGE STRUCTURE WITH INTEGRATED DEVICE INTEGRATED BENEATH THE SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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MCCLURE, QUALEY & RODACK LLP |
280 INTERSTATE NORTH CIRCLE |
SUITE 550 |
ATLANTA, GA 30339 |
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05/30/2024 08:58 AM
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