Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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18161662
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Filing Dt:
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01/30/2023
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Publication #:
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Pub Dt:
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06/01/2023
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Inventors:
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Shih-Chun Huang, Chien-Wen Lai, Ya Hui Chang, Ru-Gun Liu, Yu-Tien Shen, Ya-Wen Yeh et al
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Title:
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Directional Deposition for Semiconductor Fabrication
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| DALLAS, TX 75219 |
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05/30/2024 03:20 PM
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