Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17570647
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Filing Dt:
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01/07/2022
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Publication #:
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Pub Dt:
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05/25/2023
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Inventors:
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Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Xiaojin Wei et al
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Title:
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Temperature Control Element Utilized in Device Die Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1600 AMPHITHEATRE PARKWAY |
| MOUNTAIN VIEW, CALIFORNIA 94043 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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06/20/2024 06:41 AM
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