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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11955407
Issue Dt:
04/09/2024
Application #:
17151267
Filing Dt:
01/18/2021
Publication #:
20210225734
Pub Dt:
07/22/2021
Inventors:
Edward Fuergut, Davide Chiola, Martin Gruber, Wolfram Hable
Title:
ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A FLUID HEATSINK
Assignment: 1
Reel/Frame:
057712/0667Recorded: 10/06/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHIOLA, DAVIDE
Exec Dt:
09/20/2021
FUERGUT, EDWARD
Exec Dt:
08/17/2021
GRUBER, MARTIN
Exec Dt:
08/16/2021
HABLE, WOLFRAM
Exec Dt:
02/09/2021
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959
Assignment: 2
Reel/Frame:
058606/0479Recorded: 01/04/2022Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 057712 FRAME: 0667. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
CHIOLA, DAVIDE
Exec Dt:
09/20/2021
FUERGUT, EDWARD
Exec Dt:
08/17/2021
GRUBER, MARTIN
Exec Dt:
08/16/2021
HABLE, WOLFRAM
Exec Dt:
10/07/2021
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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