Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17861125
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Filing Dt:
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07/08/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Yoshihiro TOMITA, Shawna M. LIFF, Joshua D. HEPPNER, Eric J. LI, Javier A. FALCON
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Title:
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ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW 5TH AVENUE, STE. 1900 |
| PORTLAND, OR 97204 |
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05/29/2024 04:30 PM
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