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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/16/2024
Application #:
17875658
Filing Dt:
07/28/2022
Publication #:
Pub Dt:
01/19/2023
Inventors:
BO CHEN CHEN, Sheng-Wei Wu, Yung-Li Tsai
Title:
APPARATUS AND METHOD FOR WAFER CLEANING
Assignment: 1
Reel/Frame:
065432/0113Recorded: 11/02/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/17/2021
Exec Dt:
12/21/2021
Assignee:
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
1101 K STREET
10TH FLOOR
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
066543/0144Recorded: 02/23/2024Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/23/2022
Assignee:
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
EDITH THOMPSON
1101 K. STREET, 10TH FLOOR
WASHINGTON, DC 20005

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