Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17461828
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
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Title:
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SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| FOLEY & LARDNER LLP |
| 500 WOODWARD AVENUE |
| SUITE 2700 |
| DETROIT, MI 48226 |
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05/29/2024 10:56 AM
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