Patent Assignment Abstract of Title
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Total Assignments:
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17349234
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Filing Dt:
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06/16/2021
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Inventors:
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Joshua Windmiller, Jared Rylan Tangney
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Title:
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Heterogeneous Integration Of Silicon-Fabricated Solid Microneedle Sensors And CMOS Circuitry
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4535 TOWNE CENTRE COURT |
#200 |
SAN DIEGO, CALIFORNIA 92121 |
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CLAUSE EIGHT |
P.O. BOX 230850 |
ENCINITAS, CA 92023-0850 |
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09/23/2024 01:58 PM
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