Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17719342
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Filing Dt:
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04/12/2022
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Publication #:
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Pub Dt:
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07/06/2023
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Inventors:
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Bor-Shiun LEE, Pei-Chi KUO, Ming-Fa CHEN
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Title:
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MICROELECTROMECHANICAL SENSOR AND SENSING MODULE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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195, SEC. 4, CHUNG HSING RD., CHUTUNG |
HSINCHU, TAIWAN 310401 |
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MASCHOFF BRENNAN |
1389 CENTER DRIVE, SUITE 300 |
PARK CITY, UT 84098 |
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05/14/2024 06:16 AM
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