Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2024
|
Application #:
|
17536328
|
Filing Dt:
|
11/29/2021
|
|
Publication #:
|
|
Pub Dt:
|
04/27/2023
| | | | |
|
Inventor:
|
Shun-Hsing Liao
|
|
Title:
|
SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.9 JIANYE EAST ROAD,,ZHONGSHAN TORCH DEVELOPMENT ZONE |
| ZHONGSHAN, CHINA |
|
|
|
|
| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
|
|
Search Results as of:
06/27/2024 03:06 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
