Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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18278237
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Filing Dt:
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08/22/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Peng LI, Wei XI, Xiaobo LI, Hao YAO, Yang YU, Tiantian CAI, Junjian CHEN
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Title:
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CHIP-LEVEL SOFTWARE AND HARDWARE COOPERATIVE RELAY PROTECTION DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 86 OF ROOM 406, NO. 1 YICHUANG STREET |
| CHINA-SINGAPORE GUANGZHOU KNOWLEDGE CITY, HUANGPU DISTRICT, GUANGDONG |
| GUANGZHOU, CHINA 510700 |
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| SEYFARTH SHAW LLP |
| 233 S. WACKER DRIVE |
| SUITE 8000 |
| CHICAGO, 60606-6448 UNITED STATES |
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